A recent report on Wafer Level Packaging Market provides a detailed analysis on the industry size, revenue forecasts and geographical landscape pertaining to this business space. Additionally, the report highlights primary obstacles and latest growth trends accepted by key players that form a part of the competitive spectrum of this business.
The Global Wafer Level Packaging Market 2020 research provides a basic overview of the industry including definitions, classifications, applications, and industry chain structure. The Global Wafer Level Packaging market analysis is provided for the international markets including development trends, competitive landscape analysis, and key regions development status. The global Wafer Level Packaging market was valued at xx million US$ in 2020 and will reach xx million US$ by the end of 2027, growing at a CAGR of xx% during 2021-2027.
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Wafer-level packaging (WLP) is the technology of packaging an integrated circuit while still part of the wafer, in contrast to the more conventional method of slicing the wafer into individual circuits (dice) and then packaging them. WLP is essentially a true chip-scale package (CSP) technology, since the resulting package is practically of the same size as the die. Wafer-level packaging allows integration of wafer fab, packaging, test, and burn-in at wafer level in order to streamline the manufacturing process undergone by a device from silicon start to customer shipment.
Wafer-level packaging consists of extending the wafer fab processes to include device interconnection and device protection processes. Most other kinds of packaging do wafer dicing first, and then put the individual die in a plastic package and attach the solder bumps. Wafer-level packaging involves attaching the top and bottom outer layers of packaging, and the solder bumps, to integrated circuits while still in the wafer, and then wafer dicing.
There is no single industry-standard method of wafer-level packaging at present.
A major application area of WLPs are smartphones due to the size constraints.
This report focuses on Wafer Level Packaging volume and value at global level, regional level and company level. From a global perspective, this report represents overall Wafer Level Packaging market size by analyzing historical data and future prospect.
Regionally, this report categorizes the production, apparent consumption, export and import of Wafer Level Packaging in North America, Europe, China, Japan, Southeast Asia and India.
For each manufacturer covered, this report analyzes their Wafer Level Packaging manufacturing sites, capacity, production, ex-factory price, revenue and market share in global market.
The following manufacturers are covered:
Amkor Technology Inc
Jiangsu Changjiang Electronics
Tokyo Electron Ltd
Applied Materials, Inc
ASML Holding NV
Lam Research Corp
China Wafer Level CSP Co. Ltd
Marvell Technology Group Ltd
Siliconware Precision Industries
Segment by Regions
Segment by Type
3D TSV WLP
2.5D TSV WLP
Others ( 2D TSV WLP and Compliant WLP)
Segment by Application
IT & Telecommunication
Aerospace & Defense
Others (Media & Entertainment and Non-Conventional Energy Resources)
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Table of Contents
1 Industry Overview of Wafer Level Packaging
1.1 Definition of Wafer Level Packaging
1.2 Wafer Level Packaging Segment by Type
1.2.1 Global Wafer Level Packaging Production Growth Rate Comparison by Types (2014-2025)
1.2.2 3D TSV WLP
1.2.3 2.5D TSV WLP
1.2.5 Nano WLP
1.2.6 Others ( 2D TSV WLP and Compliant WLP)
1.3 Wafer Level Packaging Segment by Applications
1.3.1 Global Wafer Level Packaging Consumption Comparison by Applications (2014-2025)
1.3.3 IT & Telecommunication
1.3.6 Aerospace & Defense
1.3.8 Others (Media & Entertainment and Non-Conventional Energy Resources)
1.4 Global Wafer Level Packaging Overall Market
1.4.1 Global Wafer Level Packaging Revenue (2014-2025)
1.4.2 Global Wafer Level Packaging Production (2014-2025)
1.4.3 North America Wafer Level Packaging Status and Prospect (2014-2025)
1.4.4 Europe Wafer Level Packaging Status and Prospect (2014-2025)
1.4.5 China Wafer Level Packaging Status and Prospect (2014-2025)
1.4.6 Japan Wafer Level Packaging Status and Prospect (2014-2025)
1.4.7 Southeast Asia Wafer Level Packaging Status and Prospect (2014-2025)
1.4.8 India Wafer Level Packaging Status and Prospect (2014-2025)
2 Manufacturing Cost Structure Analysis
2.1 Raw Material and Suppliers
2.2 Manufacturing Cost Structure Analysis of Wafer Level Packaging
2.3 Manufacturing Process Analysis of Wafer Level Packaging
2.4 Industry Chain Structure of Wafer Level Packaging
3 Development and Manufacturing Plants Analysis of Wafer Level Packaging
3.1 Capacity and Commercial Production Date
3.2 Global Wafer Level Packaging Manufacturing Plants Distribution
3.3 Major Manufacturers Technology Source and Market Position of Wafer Level Packaging
3.4 Recent Development and Expansion Plans
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